A longtime customer of ours Iowa Scaled Engineering has just finished a BUILDING MRSERVO blog post. This writeup details the multi-step process they use to assemble one of their flagship products with our kapton stencils. I have partially covered their process and recommend you see their detailed writeup for their entire process.
Step 2: The next step is to apply the solder paste. A decent line of paste is applied to a putty knife.
Step 3: It is then drawn across the stencil, leaving a layer of paste. Then, the excess is scraped off and the PCB carefully removed from beneath the stencil.
Step 4: Below you can see the islands of solder paste left on the PCB.
Step 5: Once the solder paste has been applied, it is time to place the components.
Step 6: After Reflow the remaining thru-hole parts are soldered in place to complete the product.